document number: 40042 for technical questions, contact: tantalum@vishay.com www.vishay.com revision: 22-apr-09 35 solid tantalum chip capacitors, t antamount ? , leadframeless molded 292d vishay sprague not recommended for new designs performance characteristics operating temperature: - 55 c to + 85 c (to + 125 c with voltage derating) note ? refer to doc. 40088 capacitance range: 1.0 f to 47 f capacitance tolerance: 10 %, 20 % standard voltage rating: 3 wvdc to 20 wvdc note ? preferred tolerance and reel sizes are in bold * pb containing terminations are not rohs compliant, exemptions may apply p and r cases ima g e is not to scale ordering information 292d 106 x0 010 p 2 t type capacitance capacitance to l e r a n c e dc voltage rating at + 85 c case code termination reel size and packaging this is expressed in picofarads. the first two digits are the significant figures. the third is the number of zeros to follow. x0 = 20 % x9 = 10 % this is expressed in volts. to complete the three-digit block, zeros precede the voltage rating. a decimal point is indicated by an ?r? (6r3 = 6.3 v). see ratings and case codes table 2 = 100 % tin 4 = gold plated 8 = solder plated (60/40) special order t = tape and reel* 7" [178 mm] reel w = 13" [330 mm] reel *cathode nearest sprocket hole dimensions in inches [millimeters] case eia l w h p r 0805 [2012] 0.079 0.008 [2.0 0.2] 0.051 0.008 [1.3 0.2] 0.047 (max.) [1.2 max.] 0.020 0.012 [0.5 0.3] p 0805 [2012] 0.079 0.010 [2.0 0.25] 0.053 0.008 [1.35 0.2] 0.053 0.008 [1.35 0.2] 0.020 0.012 [0.5 0.3] tantalum wire nib identifies anode (+) terminal h l p p w ratings and case codes f 3 v 4 v 6.3 v 10 v 16 v 20 v 1.0 r r r 2.2 r r r r r 3.3 r p/r r 4.7 r r p/r r 6.8 r r p/r 10 r p/r p/r p 15 r r p 22 p/r p/r 33 p/r p 47 p
292d vishay sprague solid tantalum chip capacitors, t antamount ? leadframeless molded www.vishay.com for technical questions, contact: tantalum@vishay.com document number: 40042 36 revision: 22-apr-09 not recommended for new designs standard ratings capacitance (f) case code part number max dcl at + 25 c (a) max df at + 25 c (%) max esr at 100 khz ( ) max ripple 100 khz i rms (a) 3 wvdc at + 85 c, 1.9 wvdc at + 125 c 47 p 292d476x_003p2t 1.5 12 6.0 0.21 4 wvdc at + 85 c, 2.7 wvdc at + 125 c 2.2 r 292d225x_004r2t 0.5 6 7.6 0.057 3.3 r 292d335x_004r2t 0.5 6 7.6 0.057 4.7 r 292d475x_004r2t 0.5 6 6.3 0.063 6.8 r 292d685x_004r2t 0.5 6 5.5 0.067 10 r 292d106x_004r2t 0.5 6 5.1 0.070 15 r 292d156x_004r27 0.8 8 3.5 0.085 22 p 292d226x_004p2t 0.9 8 3.5 0.085 22 r 292d226x_004r2t 0.9 10 3.5 0.085 33 p 292d336x_004p2t 1.3 10 3.5 0.085 33 p 292d336x_004p2t_035 1.3 10 1.1 0.151 33 r 292d336x_004r2t 1.3 12 3.5 0.085 6.3 wvdc at + 85 c, 4 wvdc at + 125 c 2.2 r 292d225x_6r3r2t 0.5 10 7.6 0.057 4.7 r 292d475x_6r3r2t_035 0.6 6 2.0 0.086 4.7 r 292d475x_6r3r2t 0.6 6 3.4 0.086 6.8 r 292d685x_6r3r2t 0.5 6 5.0 0.071 6.8 r 292d685x_6r3r2t_035 0.5 6 2.0 0.067 10 p 292d106x_6r3p2t 0.6 6 3.5 0.085 10 r 292d106x_6r3r2t 0.6 6 1.2 0.144 15 r 292d156x_6r3r2t_035 0.9 10 3.5 0.085 15 r 292d15x_6r3r2_035 0.9 10 1.8 0.118 22 p 292d226x_6r3p2t 1.3 10 3.5 0.118 22 p 292d226x_6r3p2_035 0.9 10 1.1 0.151 22 r 292d226x_6r3r2t 1.4 10 3.5 0.085 33 p 292d336x_6r3p2t 2.1 12 3.5 0.085 10 wvdc at+ 85 c, 7 wvdc at + 125 c 1.0 r 292d105x_010r2 0.5 4 9.6 0.051 2.2 r 292d225x_010r2t 0.5 6 6.3 0.063 3.3 r 292d335x_010r2t 0.5 8 2.0 0.112 3.3 r 292d335x_010r2_035 0.5 8 1.0 0.158 3.3 p 292d335x_010p2t 0.5 8 2.0 0.112 4.7 p 292d475x_010p2t 0.5 8 5.0 0.071 4.7 r 292d475x_010r2t 0.5 8 5.0 0.071 4.7 r 292d475x_010r2t_035 0.5 8 2.0 0.112 6.8 p 292d685x_010p2t 0.7 8 2.0 0.112 6.8 r 292d685x_010r2t 0.7 8 2.0 0.112 10 p 292d106x_010p2t 1.0 8 2.0 0.112 10 r 292d106x_010r2t 1.0 8 2.0 0.112 15 p 292d156x_010p2t 1.5 8 3.5 0.085 15 p 292d156x_010p2_035 1.5 8 1.1 0.151 16 wvdc at + 85 c, 10 wvdc at + 125 c 1.0 r 292d105x_016r2 0.5 4 9.3 0.052 2.2 r 292d225x_016r2t 0.35 8 6.0 0.065 3.3 r 292d335x_016r2t 0.53 8 6.0 0.065 3.3 r 292d335x_016r2_035 0.53 8 3.0 0.091 4.7 r 292d475x_016r2t 0.75 8 6.0 0.065 10 p 292d106x_016p2t 1.6 8 6.0 0.065 20 wvdc at + 85 c, 13 wvdc at + 125 c 1.0 r 292d105x_020r2t 0.2 8 5.0 0.071 2.2 r 292d225x_020r2t 0.5 8 6.0 0.140
document number: 40042 for technical questions, contact: tantalum@vishay.com www.vishay.com revision: 22-apr-09 37 292d solid tantalum chip capacitors, t antamount ? leadframeless molded vishay sprague not recommended for new designs capacitors performance characteristics notes ? at + 25 c, the leakage current shall not exceed the value listed in the standard ratings table ? at + 85 c , the leakage current shall not exceed 10 times t he value listed in the standard ratings table ? at + 125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table electrical performan ce characteristics item performance characteristics category temperature range - 55 c to + 85 c (to + 125 c with voltage derating) capacitance tolerance 20 %, 10 % (at 120 hz) 2 v rms at + 25 c using a capacitance bridge dissipation factor (at 120 hz) limi ts per standard ratings table. tested via bridge method, at 25 c, 120 hz. esr (100 khz) limits per standard ratings table. tested via bridge method, at 25 c, 100 khz. leakage current after application of rated voltage applied to capacitors for 5 minutes using a steady source of power with 1 k resistor in series with the capac itor under test, leakage current at 25 c is not more than described in. see graph below for the appropriate adjustment factor. reverse voltage capacitors are capable of withstanding peak vo ltages in the reverse direction equal to: 10 % of the dc 5 % of the dc rating at + 85 c vishay does not recommended intentional or re petitive application of reverse voltage temperature derating if capacitors are to be used at temperatures above + 25 c, the permissible rms ripple current or voltage 1.0 at + 25 c 0.9 at + 85 c 0.4 at + 125 c maximum permissible power dissipation at 25 c (w) in free air p- + r-case: 0.025 operating temperature + 85 c rating + 125 c rating working voltage surge voltage working voltage surge voltage 45.22.73.4 6.3 8 4 5 10 13 7 8 16 20 10 12 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40 typical leakage current factor range 100 10 1.0 0.1 0.01 0.001 010 40 70 8 090 60 50 20 30 100 + 125 c + 8 5 c + 55 c + 25 c 0 c - 55 c percent of rated voltage leakage current factor
292d vishay sprague solid tantalum chip capacitors, t antamount ? leadframeless molded www.vishay.com for technical questions, contact: tantalum@vishay.com document number: 40042 38 revision: 22-apr-09 not recommended for new designs environmental performance characteristics item condition post test performance life test at + 85 c 1000 h application of rated voltage at 85 c with a 3 series resistance, mil-std 202g method 108a capacitance change refer to standard ratings table dissipation factor not to exceed 150 % of initial leakage current not to exceed 200 % of initial humidity tests at 40 c/90 % rh 500 h, no voltage applied. mil-std 202g method 103b capacitance change refer to standard ratings table dissipation factor not to exceed 150 % of initial leakage current not to exceed 200 % of initial thermal shock at - 55 c/+ 125 c, 30 min. each, for 5 cycles. mil-std 202g method 107g capacitance change refer to standard ratings table dissipation factor not to exceed 150 % of initial leakage current not to exceed 200 % of initial mechanical performance characteristics test condition condition post test performance terminal strength apply a pressure load of 5 n for 10 1 s horizontally to the center of capacitor side body. aecq-200 rev. c method 006 capacitance change refer to standard ratings table dissipation factor initial specified value or less leakage current initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. substrate bending (board flex) with parts soldered onto substrate test board, apply force to the test board for a deflection of 1 mm. aecq-200 rev. c method 005 capacitance change refer to standard ratings table dissipation factor initial specified value or less leakage current initial specified value or less vibration mil-std-202g, method 204d, 10 hz to 2000 hz, 20 g peak capacitance change refer to standard ratings table dissipation factor initial specified value or less leakage current initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. shock mil-std-202g, method 213b, condition i, 100g peak capacitance change refer to standard ratings table dissipation factor initial specified value or less leakage current initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solder heat at 260 c, for 10 s, reflow capacitance change refer to standard ratings table dissipation factor not to exceed 150 % of initial leakage current not to exceed 200 % of initial there shall be no mechanical or visual damage to capacitors post-conditioning. solderability mil-std-202g, me thod 208h, ansi/j-std-002, test b. applies only to solder and tin plated terminations. does not apply to gold terminations. there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solvents mil-std-202, method 215d there shall be no me chanical or visual damage to capacitors post-conditioning. flammability encapsulation materials meet ul94 vo with an oxygen index of 32 %.
document number: 40042 for technical questions, contact: tantalum@vishay.com www.vishay.com revision: 22-apr-09 39 292d solid tantalum chip capacitors, t antamount ? leadframeless molded vishay sprague not recommended for new designs note : metric dimensions will go vern. dimensions in inches are rounded and for reference only plastic tape and reel packaging in inches [millimeters] 0.004 [0.1] max. k 0 tape thickness b 1 max. (note 6) 0.014 [0.35] max. 0.008 [0.200] embossment 0.069 0.004 [1.75 0.10] d 1 min. f or components 0.079 x 0.047 [2.0 x 1.2] and larger . (note 5) maxim um ca vity siz e (note 1) user direction of feed center lines of ca vity a 0 p 1 f w 0.030 [0.75] min. (note 4) 0.030 [0.75] min. (note 3) 0.079 0.002 [2.0 0.05] 0.157 0.004 [4.0 0.10] 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] b 0 maxim um component rotation (side or f ront sectional vie w) 20 0 for tape feeder reference only including draft. concentric around b (note 5) deformation between embossments top cover tape top cover tape 10 pitches cumulative tolerance on tape cathode (-) anode (+) direction of feet 20 maximum component rotation t y pical component ca vity center line t y pical component center line a 0 b 0 (t op vie w) 0.9843 [250.0] t ape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. camber (t op view) allo w ab le camber to be 0.039/3.937 [1/100] non-cum ulativ e ov er 9.843 [250.0] tape and reel specifications: all case sizes are available on plastic embossed tape per eia-481- 1. tape reeling per iec 286-3 is also available. standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. the most efficient packaging quantities are full reel increments on a given reel diameter. the quantit ies shown allow for the sealed empty pockets required to be in conformance with eia-481-1. reel size and packaging orientation mu st be specified in the vishay sprague part number. case code tape size b 1 (max.) d 1 (min.) f k 0 (max.) p 1 w 292d p r 8 mm 0.092 0.0039 [2.34 0.100] 0.0394 + 0.0098 [1.5 + 0.100] 0.1378 0.0098 [3.5 0.05] 0.053 0.0039 [1.35 0.100] 0.157 0.0039 [4.0 0.2] 0.315 + 0.0118/- 0.0039 [8.0 + 0.30/- 0.10] standard packaging quantity series case code qty (pcs/reel) 7" reel 13" reel 292d p, r 2500 10 000
292d vishay sprague solid tantalum chip capacitors, t antamount ? leadframeless molded www.vishay.com for technical questions, contact: tantalum@vishay.com document number: 40042 40 revision: 22-apr-09 not recommended for new designs recommended voltage derating guidelines standard conditions: for example: output filters capacitor voltage rating operating voltage 4.0 2.5 6.3 3.6 10 6.0 16 10 20 12 25 15 35 24 50 28 severe conditions: for example: input filters capacitor voltage rating operating voltage 4.0 2.5 6.3 3.3 10 5.0 16 8.0 20 10 25 12 35 15 50 24 recommended reflow profiles type t p lead (pb)-free t p sn/pb t p t l lead (pb)-free t l sn/pb t s min. lead (pb)-free t s min. sn/pb t s max. lead (pb)-free t s max. sn/pb t s lead (pb)-free t s sn/pb t l 292d 260 c 225 c 10 217 c 183 c 150 c 100 c 200 c 150 c 60 - 150 60 - 90 70 temperature (c) 25 c all case codes preheat (t s ) t p c t l c t s max. c t s max. c (t p ) (t l ) pad dimensions in inches [millimeters] case code a b c d 292d p, r 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] a b c d
document number: 40042 for technical questions, contact: tantalum@vishay.com www.vishay.com revision: 22-apr-09 41 292d solid tantalum chip capacitors, t antamount ? leadframeless molded vishay sprague not recommended for new designs guide to application 1. a-c ripple current: the maximum allowable ripple current shall be determined from the formula: where, p = power dissipation in watts at + 25 c as given in the table in paragraph number 5 (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency. 2. a-c ripple voltage: the maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, p = power dissipation in watts at + 25 c as given in the table in paragraph number 5 (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency. z = the capacitor impedance at the specified frequency. 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at + 25 c. 3. reverse voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the dc rating at + 25 c, 5 % of the dc rating at + 85 c and 1 % of the dc rating at + 125 c. 4. temperature derating: if these capacitors are to be operated at temperatures above + 25 c, the permissible rms ripple curre nt or voltage shall be calculated using the derating factors as shown: 5. power dissipation: power dissipation will be affected by the heat sinki ng capability of the mounting surface. non-sinusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power dissipation calculated using + 25 c temperature rise.) 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina subs trates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after application is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the fl ux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. the soldering profile charts show recommended time/temperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per second. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at te mperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forward compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous cleaning media. however, cfc/ods products are not used in the production of these devices and are not recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 minutes. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of t he soldering process and/or circuit board design. temperature derating factor + 25 c 1.0 + 85 c 0.9 + 125 c 0.4 i rms p r esr --------------- - = v rms z p r esr --------------- - = v rms i rms z =
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.
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